Document Type and Number:
Japanese Patent JPH0193199
Kind Code:
U
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Application Number:
JP19023287U
Publication Date:
June 19, 1989
Filing Date:
December 14, 1987
Export Citation:
International Classes:
B64C31/02; B64C31/036; B64D17/10; (IPC1-7): B64D17/10; B64C31/02
Next Patent: ELECTRONIC CIRCUIT SUBSTRATE FIXING STRUCTURE