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Patent Searching and Data


Document Type and Number:
Japanese Patent JPH0214810
Kind Code:
B2
Abstract:
An electronic component made by the steps of: preparing elongated tape (10), distributing a plurality of pairs of electronic elements (1) over the tape (10) lengthwise of the latter and bonding the pairs to the tape (10) in such a manner that the two elements (1) in each pair are positioned one in each of the first and second regions (12, 13) of the tape (10) separated from each other substantially by the longitudinal centerline (11) of the tape (10), folding the tape (10) along the longitudinal centerline (11) so that the two elements (1) in each pair are opposed at least partially to each other, preparing a terminal assembly (18) having a frame (17) on which a plurality of terminals (14, 15, 16) to be connected to the elements (1) are held so that they are distributed lengthwise of the frame (17), arranging the frame (17) parallel to the tape (10) and effecting connection between the terminals (14, 15, 16) and the elements (1), cutting the tape (10) along widthwise extending cutting lines to separate the sets of elements (1) from each other, and cutting off the terminals (14, 15, 16) from the frame (17).

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Inventors:
ITO KATSUO
CHIGA YASUSHI
MURATA YOSHIO
Application Number:
JP10463982A
Publication Date:
April 10, 1990
Filing Date:
June 16, 1982
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H03H7/09; H01G4/40; H01L27/01; H03H1/00; H03H5/02