Document Type and Number:
Japanese Patent JPH0224810
Kind Code:
Y2
More Like This:
JPH05125816 | JIG FOR LEVELING OF BUNDLE BASE |
Application Number:
JP19603583U
Publication Date:
July 09, 1990
Filing Date:
December 20, 1983
Export Citation:
International Classes:
E02D27/00; E04B1/38; E04B1/41; E04B1/58; (IPC1-7): E04B1/38; E04B1/40
Next Patent: THIN-FILM MAGNETIC HEAD AND ITS MANUFACTURE