Document Type and Number:
Japanese Patent JPH0249084
Kind Code:
B2
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Inventors:
HOTSUTA YUKISUKE
Application Number:
JP13246486A
Publication Date:
October 29, 1990
Filing Date:
June 07, 1986
Export Citation:
Assignee:
HOTSUTA YUKISUKE
International Classes:
A47G33/02
Next Patent: BONDING RESIN COMPOSITION