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Document Type and Number:
Japanese Patent JPH0315359
Kind Code:
B2
Abstract:
An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.

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JP2767670[Title of the Invention] A holder for an electronic component chip and a method for forming an electrode of an electronic component chip using the holder.
Inventors:
FUIRITSUPU EI REIGAADO
ROI MAABIN HOWAITEINGU
MAIKURU DEI SUNAIDAA
Application Number:
JP13037978A
Publication Date:
February 28, 1991
Filing Date:
October 23, 1978
Export Citation:
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Assignee:
YUNIBAASARU INSUTSURUMENTSU CORP
International Classes:
H05K13/00; H01L21/683; H05K3/34; H05K13/02; H05K13/04



 
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