Document Type and Number:
Japanese Patent JPH0333045
Kind Code:
B2
Abstract:
Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.
Inventors:
DONARUDO FUAI
JON TOOMASU RETSUGU
MAAKU UINSENTO PIASON
JON TOOMASU RETSUGU
MAAKU UINSENTO PIASON
Application Number:
JP3545588A
Publication Date:
May 15, 1991
Filing Date:
February 19, 1988
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
B21C23/24; B21C25/02; B21J5/06; B29C45/14; H01R43/20; B29L31/34; H05K1/09; H05K3/10; H05K3/40