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Patent Searching and Data


Document Type and Number:
Japanese Patent JPH0349424
Kind Code:
Y2
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JPH06325838PACKAGING STRUCTURE FOR HYBRID INTEGRATED CIRCUIT
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Application Number:
JP3545284U
Publication Date:
October 22, 1991
Filing Date:
March 12, 1984
Export Citation:
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International Classes:
H05K3/34; (IPC1-7): H05K3/34



 
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