【考案の名称】半導体パツケージ用セラミツク基板

Title:

【考案の名称】半導体パツケージ用セラミツク基板

Document Type and Number:

Japanese Patent JPH04107842

Kind Code:

U

Inventors:

Kawase Hideyuki
Yutaka Kaji
Shigeo Mizuno

Application Number:

JP1782391U

Publication Date:

September 17, 1992

Filing Date:

February 28, 1991

Export Citation:

International Classes:

H01L23/13; H01L23/12; (IPC1-7): H01L23/13; H01L23/12

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