Title:
【考案の名称】半導体装置およびその捺印方法
Document Type and Number:
Japanese Patent JPH04121743
Kind Code:
U
Inventors:
Shinichi Takeda
Application Number:
JP2699291U
Publication Date:
October 30, 1992
Filing Date:
April 20, 1991
Export Citation:
International Classes:
H01L23/00; (IPC1-7): H01L23/00
Domestic Patent References:
| JPS63222448A | 1988-09-16 | |||
| JP1076048B | ||||
| JP63105340B | ||||
| JP1146537B |