Title:
【考案の名称】半導体装置樹脂封止用金型
Document Type and Number:
Japanese Patent JPH04127648
Kind Code:
U
Inventors:
Sugawara Tsuyoshi
Application Number:
JP3405791U
Publication Date:
November 20, 1992
Filing Date:
May 15, 1991
Export Citation:
International Classes:
B29C33/38; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C33/38; B29C45/26; B29L31:34
Domestic Patent References:
| JPS611730U | 1986-01-08 | |||
| JPS5831538A | 1983-02-24 |
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