Title:
【考案の名称】スタンプ装置
Document Type and Number:
Japanese Patent JPH04130878
Kind Code:
U
Abstract:
A stamp device employs a heat sensitive stencil paper which includes a thermoplastic film and a porous carrier. The heat sensitive stencil paper is perforated by a thermal head according to characters, symbols, figures, etc. of an image input from an input mechanism. The display can be controlled to display a layout of the image to be perforated on the heat sensitive stencil paper. Therefore, a user can determine whether the layout is acceptable prior to perforating the stencil sheet. Consequently, the user can accurately print at a desired position on a recording medium by confirming the layout on the display prior to printing.
Inventors:
Hiroshi Kawahara
Application Number:
JP3675691U
Publication Date:
December 01, 1992
Filing Date:
May 23, 1991
Export Citation:
International Classes:
B41K1/32; B41L13/02; (IPC1-7): B41L13/02; B41K1/32; B41L13/02