Title:
【考案の名称】半導体素子の冷却機構
Document Type and Number:
Japanese Patent JPH04134856
Kind Code:
U
Inventors:
Shinya Akamatsu
Application Number:
JP5105091U
Publication Date:
December 15, 1992
Filing Date:
June 06, 1991
Export Citation:
International Classes:
H01L23/473; H01L23/46; (IPC1-7): H01L23/473; H01L23/46