Document Type and Number:
Japanese Patent JPH0444632
Kind Code:
B2
Abstract:
Joined structures are disclosed, which comprise first and second members (1,3) having different coefficients of thermal expansion and an intermediate member (2) joining the first and second members. The intermediate member (2) has yield stress smaller than those of the first and second members, and a tapered portion (4) is formed at an outer peripheral surface of the intermediate member (2). The tapered portion (4) has a variable cross-sectional area orthogonal to an axis of the joined members, this area being larger at one end of the tapered portion near that one of the first and second members having a smaller coefficient of thermal expansion.
Inventors:
YOSHIDA AKIHIKO
NAKASUJI YOSHIATSU
NAKASUJI YOSHIATSU
Application Number:
JP8297387A
Publication Date:
July 22, 1992
Filing Date:
April 06, 1987
Export Citation:
Assignee:
NGK INSULATORS LTD
International Classes:
B23P11/02; B23K1/19; C04B37/02; F02F3/00; F16B4/00
Next Patent: JPH0444633