Title:
【発明の名称】半導体チップを含むインダクタンスの小さいカプセル封じパッケージ
Document Type and Number:
Japanese Patent JPH04503283
Kind Code:
A
Abstract:
A non-hermetic encapsulated semiconductor device package (90) includes wide flat leads (46b, 48b) bonded to the upper surface contact pads (16, 18) of the device. These leads are preferably solderless bonded to these contact pads.
Inventors:
New Jibower, Constantine Alois
Robert Joseph, Sataliano
Burgess, James Francis
Donald Leland, Watrose
Robert Joseph, Sataliano
Burgess, James Francis
Donald Leland, Watrose
Application Number:
JP50955190A
Publication Date:
June 11, 1992
Filing Date:
June 12, 1990
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H01L21/60; H01L23/48; H01L23/485; (IPC1-7): H01L21/60; H01L23/48
Attorney, Agent or Firm:
Tokunji Ikunuma