Title:
【発明の名称】電着された銅箔およびこれを低塩素イオン濃度の電解質溶液を用いて製造する方法
Document Type and Number:
Japanese Patent JPH05502062
Kind Code:
A
Abstract:
This invention relates to electrodeposited copper foil having an elongation measured at 180 DEG C. in excess of about 5.5%, an ultimate tensile strength measured at 23 DEG C. in excess of about 60,000 psi, and a matte-side Rtm in the range of about 4.5 to about 18 mu m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.
Inventors:
Clauser, Sidney Jay.
Dyfranco, Dinoev.
Hasegawa, Craig Jay.
Dyfranco, Dinoev.
Hasegawa, Craig Jay.
Application Number:
JP51029191A
Publication Date:
April 15, 1993
Filing Date:
May 24, 1991
Export Citation:
Assignee:
G-Tech Inc.
International Classes:
C25D1/04; H05K1/09; C25D3/38; C25D7/06; H05K3/38; (IPC1-7): C25D1/04
Attorney, Agent or Firm:
Hidesaku Yamamoto