Title:
【発明の名称】酸化物層形成金属および合金用のハンダ
Document Type and Number:
Japanese Patent JPH05508113
Kind Code:
A
Abstract:
A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 DEG C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.
Inventors:
Kronberg, James William
Application Number:
JP51001592A
Publication Date:
November 18, 1993
Filing Date:
April 08, 1992
Export Citation:
Assignee:
THE UNITED STATES OF AMERICA
International Classes:
B23K1/19; B23K35/02; B23K35/26; B23K35/32; C22C13/00; B23K1/06; (IPC1-7): B23K35/26; B23K1/06; B23K1/19; C22C13/00
Attorney, Agent or Firm:
Sota Asahina