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Patent Searching and Data


Title:
【発明の名称】半導体ウェハ加熱装置
Document Type and Number:
Japanese Patent JPH06103670
Kind Code:
B2
Inventors:
蔦原 晃一郎
田中 博司
Application Number:
JP8397489A
Publication Date:
December 14, 1994
Filing Date:
April 04, 1989
Export Citation:
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Assignee:
三菱電機株式会社
International Classes:
H01L21/205; B01F13/08; H01L21/00; H01L21/31; H01L21/324; H01L23/34; H02K44/06; H05B3/22; H05B6/34; (IPC1-7): H01L21/205; H01L21/324
Attorney, Agent or Firm:
曾我 道照 (外4名)