Title:
【発明の名称】大量はんだ付け装置
Document Type and Number:
Japanese Patent JPH06104274
Kind Code:
B2
Abstract:
A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.
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Inventors:
Boynton, Kenneth Gee
Cedric, Victor, Junior
Lowell, Charles Earl
Cedric, Victor, Junior
Lowell, Charles Earl
Application Number:
JP50583486A
Publication Date:
December 21, 1994
Filing Date:
October 28, 1986
Export Citation:
Assignee:
Hollis O-Tome-Syon Inco-Pole-Ted
International Classes:
B23K1/08; H05K3/34; (IPC1-7): B23K1/08; H05K3/34
Domestic Patent References:
| JP60191659A | ||||
| JP594965A |
Attorney, Agent or Firm:
Soichi Takezawa
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