Title:
【発明の名称】半導体装置とその製造方法
Document Type and Number:
Japanese Patent JPH069203
Kind Code:
B2
Inventors:
OKUMURA KATSUYA
Application Number:
JP7917187A
Publication Date:
February 02, 1994
Filing Date:
March 31, 1987
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L29/43; H01L21/28; H01L21/3205; H01L21/336; H01L23/52; H01L29/78; (IPC1-7): H01L21/3205; H01L21/336; H01L29/46; H01L29/784
Domestic Patent References:
| JP61224435A | ||||
| JP61258452A | ||||
| JP6232610A | ||||
| JP62132359A |
Attorney, Agent or Firm:
Kazuo Sato (2 outside)