Title:
【発明の名称】電子部品接続装置
Document Type and Number:
Japanese Patent JPH07109934
Kind Code:
B2
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Inventors:
Yasuo Izumi
Yamauchi Dai
Yamauchi Dai
Application Number:
JP8696691A
Publication Date:
November 22, 1995
Filing Date:
April 18, 1991
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
G01B11/24; H01L23/50; H05K3/34; H05K13/04; (IPC1-7): H05K3/34; G01B11/24; H01L23/50; H05K13/04
Domestic Patent References:
| JP2232999A | ||||
| JP62283581A |
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Previous Patent: Laminated ceramic electronic component and manufacturing method thereof
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