Title:
【発明の名称】半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JPH07120805
Kind Code:
B2
Inventors:
Noriaki Kodama
Application Number:
JP25770387A
Publication Date:
December 20, 1995
Filing Date:
October 12, 1987
Export Citation:
Assignee:
NEC
International Classes:
H01L27/04; H01L21/336; H01L21/822; H01L29/78; H01L29/786; (IPC1-7): H01L29/786; H01L21/336
Domestic Patent References:
| JP5691470A | ||||
| JP5999772A | ||||
| JP59205761A | ||||
| JP62163363A | ||||
| JP62219653U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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