Title:
【発明の名称】小型の走査アレイを組み合せて長尺のアレイを形成する方法
Document Type and Number:
Japanese Patent JPH07121045
Kind Code:
B2
Abstract:
A process for fabricating a full width scanning or printing array (3) in which plural smaller scanning or printing chips (5) are bonded end-to-end onto an glass substrate (10) using a photocurable adhesive to form a subassembly (4), following which the subassembly is inverted and joined to a second substrate (6) having a conductive surface (8) using a conductive heat activated adhesive.
Inventors:
You're O Labran
Application Number:
JP27204990A
Publication Date:
December 20, 1995
Filing Date:
October 09, 1990
Export Citation:
Assignee:
Xerox Corporation
International Classes:
H04N1/028; H01L25/04; H01L27/14; H01L27/146; H01L27/148; H04N1/024; H04N1/19; (IPC1-7): H04N1/028; H01L27/14
Domestic Patent References:
| JP63169167A | ||||
| JP63205950A | ||||
| JP1228166A |
Attorney, Agent or Firm:
Kobori Masashi