Title:
【発明の名称】はんだ保持リードを有する表面実装可能な集積回路パッケージ
Document Type and Number:
Japanese Patent JPH0736434
Kind Code:
B2
Abstract:
An integrated circuit package having a plurality of leads capable of holding a quantity of solder paste prior to bonding to a printed circuit board or other substrate. The solder paste bearing structure may be straight or spiral grooves, or even a slot or roughened surface, running down at least the lower length of the leads as long as some mechanism is present which will first hold the solder paste or other electrically conductive binder on the lead and then deliver the binder to the end of the lead to produce an electrical and structural bond in a binder flowing operation. Application of the solder paste to the leads is accomplished by simply dipping the package leads into the paste thereby eliminating the need to make a solder mask for the substrate as well as the task of aligning the mask to the substrate.
More Like This:
| JP2013138261 | SEMICONDUCTOR DEVICE |
| JPH02130996 | DEVICE FOR USE IN ELECTRONIC COMPONENT MOUNTING |
| JPS63209153 | SET OF LSI BLOCK |
Inventors:
Lynn Paul Tay
Application Number:
JP50461386A
Publication Date:
April 19, 1995
Filing Date:
August 25, 1986
Export Citation:
Assignee:
Motorola Incorporated
International Classes:
H01L23/50; H05K1/18; H05K3/34; H05K7/02; H05K13/04; (IPC1-7): H01L23/50; H05K1/18
Domestic Patent References:
| JP57110951B | ||||
| JP57191059B | ||||
| JPS5889850A | 1983-05-28 | |||
| JPS5947747A | 1984-03-17 | |||
| JP59081043B | ||||
| JP60103847B |
Attorney, Agent or Firm:
Yoshiaki Ikeuchi
Next Patent: CHARACTER EDITING DEVICE