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Title:
【発明の名称】プリント回路基板の製造方法
Document Type and Number:
Japanese Patent JPH0754869
Kind Code:
B2
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Inventors:
Omori Wako
Application Number:
JP8417793A
Publication Date:
June 07, 1995
Filing Date:
March 17, 1993
Export Citation:
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Assignee:
Meiki Seisakusho Co., Ltd.
International Classes:
B29C45/14; B29C45/16; H05K1/14; H05K3/00; H05K3/20; B29L31/34; (IPC1-7): H05K3/00; B29C45/14; B29C45/16; H05K1/14; H05K3/20
Domestic Patent References:
JP6185892A
JP6027471U
Attorney, Agent or Firm:
Noriaki Goto (1 outside)



 
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