Title:
【発明の名称】パツケ-ジ構造体
Document Type and Number:
Japanese Patent JPH0763084
Kind Code:
B2
Abstract:
A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior ceramic cards. The ceramic card assembly combines ceramic cards with flexible power distribution structures which provide low inductance and low resistance power distribution, making ceramic cards available for for high performance VLSI systems. Each ceramic card assembly comprises a ceramic card having a plurality of chip sites and power contacts thereon, and at least one flexible power distribution structure having alternating insulation (i.e. polyimide) layers and conductor (i.e., copper) layers, the flexible power distribution structures are mounted adjacent to the ceramic cards so that conductive layers of the ceramic cards are selectively exposed to the power contacts. The ceramic card assemblies are preferably combined into a field replaceable unit that includes cold plates between ceramic cards. High density packages further include ceramic in line packages which quadruple current day memory density.
More Like This:
| JPS52114286 | SEMICONDUCTOR DEVICE |
| JP2009164382 | SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME |
| JP2009094378 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
Inventors:
Blaath Edward Break
Eritsk Blas Harzmark
Frank Patrick Prestay
Raymond Litchi
Roger Allen Ritzpens
Eritsk Blas Harzmark
Frank Patrick Prestay
Raymond Litchi
Roger Allen Ritzpens
Application Number:
JP13758688A
Publication Date:
July 05, 1995
Filing Date:
June 06, 1988
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H01L23/52; G06F1/18; H01L23/44; H01L23/538; H05K1/02; H05K7/02; H05K1/03; H05K1/14; H05K3/34; (IPC1-7): H01L23/52
Domestic Patent References:
| JP62119951A | ||||
| JP5640674U |
Attorney, Agent or Firm:
Jiro Yamamoto