Title:
【発明の名称】半導体のリード曲げ加工法
Document Type and Number:
Japanese Patent JPH0798226
Kind Code:
B2
Inventors:
Ueda Masanobu
Naozumi Hatada
Ueno Keiji
Murakami
Naozumi Hatada
Ueno Keiji
Murakami
Application Number:
JP15602986A
Publication Date:
October 25, 1995
Filing Date:
July 04, 1986
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B21D5/04; B21D5/08; H01L23/50; (IPC1-7): B21D5/08
Domestic Patent References:
| JP557291Y1 |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)
Next Patent: 蛇行パイプの曲げ加工装置