Title:
【発明の名称】板状素材打抜き装置
Document Type and Number:
Japanese Patent JPH0818086
Kind Code:
B2
Inventors:
Shibayama
Application Number:
JP20655191A
Publication Date:
February 28, 1996
Filing Date:
July 23, 1991
Export Citation:
Assignee:
Shibayama Machinery Co., Ltd.
International Classes:
B21D28/08; B21D28/04; B21D43/05; B21D53/62; (IPC1-7): B21D28/08; B21D28/04; B21D43/05
Attorney, Agent or Firm:
Kuroda Yuji
Next Patent: SEMICONDUCTOR PHOTOSENSOR AND MANUFACTURE THEREOF