Title:
【発明の名称】高密度電子装置用はんだ付け可能なコネクタ
Document Type and Number:
Japanese Patent JPH09505437
Kind Code:
A
Abstract:
An improved connector for an electronic module or the like includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a foot portion having a layer of non-solderable material coated on one side of the foot portion to prevent solder from adhering to that side. A capillary nest is formed by a channel surface on the underside of the foot portion when the terminal is mounted on a conductor pad such that solder flows through the capillary nest under the influence of capillary forces from the side of the terminal having a non-solderable coating thereon to the other side for forming a solder joint on that other side. A ring of non-solderable material is coated around a middle portion of the terminal to prevent solder from flowing to the electrical contact surfaces located above the ring. As a result, the connector terminals can be soldered to a printed circuit board or the like in a simple and inexpensive manner and without the formation of known solder defects.
Inventors:
Belopolsky, Jacob
Application Number:
JP51452595A
Publication Date:
May 27, 1997
Filing Date:
November 14, 1994
Export Citation:
Assignee:
Berg Technology Incorporated
International Classes:
H01L23/32; H01R4/02; H01R12/04; H01R12/55; H01R33/76; H05K3/34; (IPC1-7): H01R9/09; H01L23/32; H01R4/02; H01R33/76
Attorney, Agent or Firm:
Takehiko Suzue (4 outside)