Title:
微細機械加工されたセンサ用の強固接合部
Document Type and Number:
Japanese Patent JPH09511061
Kind Code:
A
Abstract:
A micromachined device is described receiving a pressurizable fluid has a plurality of layers bonded together along at least one bond interface, the bond interface having a terminus bordering the pressurizable fluid. In a vicinity of at least one bond interface at least one layer has a shape that reduces a stress magnitude near the bond terminus. In a preferred embodiment a width of at least one layer increases toward the bond interface, to increase the pressure at which the device can operate without fracturing. In another embodiment, both layers bordering the bond interface have widths in the vicinity of the bond interface that increase toward the bond interface. Alternately, the layers have walls shaped such that, for a reference line perpendicular to the bond interface and passing through an end of the bond interface bordering the cavity, the cavity protrudes between the reference line and at least one of the walls.
Inventors:
ロモ，マーク ジー．
Application Number:
JP52515995A
Publication Date:
November 04, 1997
Filing Date:
February 22, 1995
Export Citation:
Assignee:
ローズマウント インコーポレイテッド
International Classes:
G01L9/04; G01L9/00; (IPC1-7): G01L9/04
Attorney, Agent or Firm:
平木 道人 （外１名）