Title:
【発明の名称】パッケージ入りホットメルト接着剤の製造方法
Document Type and Number:
Japanese Patent JPH10505382
Kind Code:
A
Abstract:
A method for making a packaged, hot melt adhesive in which the packaging material is compatible with the adhesive is described. A liquid pre-adhesive composition is substantially completely surrounded with a packaging material, exposed to transmissive energy, and allowed to polymerize.
Inventors:
Hummer, Craig Yi.
Moon, John Dee.
Kotonoa, Thomas A.
Moon, John Dee.
Kotonoa, Thomas A.
Application Number:
JP50950296A
Publication Date:
May 26, 1998
Filing Date:
August 10, 1995
Export Citation:
Assignee:
Minnesota Mining and Manufacturing Company
International Classes:
B29B13/02; B29C39/10; B29C67/24; B65D65/38; C09J4/00; C09J4/02; B05D7/24; C09J5/00; C09J7/02; C09J201/00; (IPC1-7): C09J201/00; C09J4/02; C09J5/00; C09J7/02
Attorney, Agent or Firm:
Takashi Ishida (3 others)