Title:
【発明の名称】プラ??発生用埋込み形コイル
Document Type and Number:
Japanese Patent JPH10510676
Kind Code:
A
Abstract:
A recessed coil for a plasma chamber in a semiconductor fabrication system is provided. Recessing the coil reduces deposition of material onto the coil which in turn leads to a reduction in particulate matter shed by the coil onto the workpiece.
Inventors:
Subrani, Ananza
Force?, John
Stephen, Bradley, Oh.
Edels Inn, Lugio
Green?, Howard
Tawn, Avi
Shu
Force?, John
Stephen, Bradley, Oh.
Edels Inn, Lugio
Green?, Howard
Tawn, Avi
Shu
Application Number:
JP54025297A
Publication Date:
October 13, 1998
Filing Date:
May 08, 1997
Export Citation:
Assignee:
Applied Therial, Inc. Rated
International Classes:
H05H1/46; C23C14/35; C23C16/50; H01J37/32; H01J37/34; H01L21/203; H01L21/205; H01L21/285; (IPC1-7): H05H1/46; C23C14/35; C23C16/50; H01J37/32; H01L21/203; H01L21/205; H01L21/285
Attorney, Agent or Firm:
Yoshiki Hasegawa (4 outside)