Document Type and Number:
Japanese Patent JPS4318023
Kind Code:
Y1
Application Number:
JP5589665U
Publication Date:
July 25, 1968
Filing Date:
July 08, 1965
Export Citation:
International Classes:
A63K3/02; (IPC1-7): A63K3/02
Previous Patent: EPOXY RESIN MOLDING MATERIAL FOR SEALING ELECTRONIC PART
Next Patent: PREPARATION OF PERFLUOROPOLYETHERACYL FLUORIDE
Next Patent: PREPARATION OF PERFLUOROPOLYETHERACYL FLUORIDE