Document Type and Number:
Japanese Patent JPS4727650
Kind Code:
Y1
More Like This:
| JPS58180029 | [Title of the device] Molding die |
Application Number:
JP5332870U
Publication Date:
August 22, 1972
Filing Date:
May 29, 1970
Export Citation:
International Classes:
(IPC1-7): B29C7/00; B29F1/14