Login| Sign Up| Help| Contact|

Patent Searching and Data


Document Type and Number:
Japanese Patent JPS4850950
Kind Code:
A
More Like This:
WO/1996/025838COPPER FOIL AND HIGH-DENSITY MULTI-LAYERED PRINTED CIRCUIT BOARD USING THE COPPER FOIL FOR INNER LAYER CIRCUIT
JP6694578Aluminum foil manufacturing method and cathode drum for aluminum foil manufacturing
JP6861304Electrolytic copper foil, electrodes containing electrolytic copper foil, and copper-clad laminates containing electrolytic copper foil
Application Number:
JP6686772A
Publication Date:
July 18, 1973
Filing Date:
July 04, 1972
Export Citation:
Click for automatic bibliography generation   Help
International Classes:
C25D1/04; B29C63/00; B32B15/04; B32B15/08; B32B37/00; B44C3/02; E04C2/08; (IPC1-7): C25D1/04



 
Previous Patent: JPS4850949

Next Patent: JPS4850951