Document Type and Number:
Japanese Patent JPS4885145
Kind Code:
A
Abstract:
1417628 Sputtering TORAY INDUSTRIES Inc 31 Oct 1973 50706/73 Heading C7F [Also in Division G2] A sputtering apparatus 10 has a film of trans-. parent plastics material 4 which is fed across a chromium plated roller 7 and taken up on roller 6. "Noble" metal 9 is sputtered from electrode 8 by D.C., R.F. or plasma sputtering. The "noble" metal is Au, Ag, Pt, Pd, In or Rh and the film is preferably polyethylene terephthalate but many other films are specified. The electrodes 7 and 8 may be cooled with water, brine, ethylene glycol or a halogenated hydrocarbon. More than one noble metal may be sputtered or an admixture with another metal or a compound. An atmosphere of Ar, He, Ne, Kr, Xe, N 2 , O 2 or air may be used in the apparatus.
Application Number:
JP1433672A
Publication Date:
November 12, 1973
Filing Date:
February 12, 1972
Export Citation:
International Classes:
G03C1/72; G03G5/07; G03G5/10; G03G5/14; G03G15/05