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Patent Searching and Data


Document Type and Number:
Japanese Patent JPS5138120
Kind Code:
B2
More Like This:
JPS6035256[Title of the device] A lead cutting device of a printed circuit board
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JP6001396An electronic component mounting device, an electronic-parts mounting method, and a cutter device
Application Number:
JP5976871A
Publication Date:
October 20, 1976
Filing Date:
August 07, 1971
Export Citation:
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International Classes:
H05K13/04; B23D29/02; B25B7/12; (IPC1-7): B25B7/12; H05K13/04



 
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