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Patent Searching and Data


Document Type and Number:
Japanese Patent JPS5146379
Kind Code:
B2
More Like This:
WO/2020/254499METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS HAVING A SIDE WALL SEALING
Application Number:
JP10486671A
Publication Date:
December 08, 1976
Filing Date:
December 22, 1971
Export Citation:
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International Classes:
H01L21/24; H01L21/329; H01L29/93; H01L21/228



 
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