Document Type and Number:
Japanese Patent JPS52156969
Kind Code:
U
More Like This:
JPH06314753 | CERAMIC MULTILAYER WIRING BOARD MODULE |
WO/2013/000560 | CIRCUIT ARRANGEMENT BODY, IN PARTICULAR COMPONENT BOARD |
Application Number:
JP6697276U
Publication Date:
November 29, 1977
Filing Date:
May 24, 1976
Export Citation:
International Classes:
H05K1/18; H05K3/32; (IPC1-7): H05K3/32