Login| Sign Up| Help| Contact|

Patent Searching and Data


Document Type and Number:
Japanese Patent JPS5337988
Kind Code:
B2
Application Number:
JP11868273A
Publication Date:
October 12, 1978
Filing Date:
October 22, 1973
Export Citation:
Click for automatic bibliography generation   Help
International Classes:
F16J15/32; F16C33/72; F16J15/324; F16J15/40



 
Previous Patent: JPS5337987

Next Patent: RESIN SEALING MOLD