Document Type and Number:
Japanese Patent JPS5338096
Kind Code:
Y2
Abstract:
An improved mounting for a semiconductor rectifier, its associated heat sink, control module and protective circuitry in which the rectifier is mounted so that wiring at both the front and rear of the assembly is possible with the heat sink used as a conductor for one terminal. The heat sink is mounted between insulating plates and has portions brought out through one or more cut-outs in the front and rear plates to conduct current there between and permit ease of making connections.
Application Number:
JP12584373U
Publication Date:
September 14, 1978
Filing Date:
October 30, 1973
Export Citation:
International Classes:
H01L23/40; H02M7/04; H05K7/20; (IPC1-7): H02M7/04; H05K7/20