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Document Type and Number:
Japanese Patent JPS5444399
Kind Code:
B2
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JP4834997Photosensitive dielectric paste and manufacturing method of electronic circuit parts using it
Application Number:
JP2816574A
Publication Date:
December 25, 1979
Filing Date:
March 13, 1974
Export Citation:
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International Classes:
H01G4/12; C25D7/00; H01B1/02; H01B1/16; H01B13/00; H01C17/16; H01G4/012; H05K3/18; H05K3/24



 
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