Document Type and Number:
Japanese Patent JPS5522194
Kind Code:
B2
Abstract:
1462510 Brazing ABRASIVE TECHNOLOGY Inc 28 June 1974 [14 Aug 1973] 28879/74 Heading B3R [Also in Division C7] In the manufacture of abrasive tools, diamond chips are bonded without pretreatment to a metal substrate by vacuum or reducing atmosphere brazing using a Ni and/or Co based brazing alloy containing at least 2% but preferably more than 5% Cr, with optionally up to 12% in total of B, Si and/or P, the brazing alloy wetting the diamond surface and forming a strong bond with the substrate. The process consists of mixing a temporary fluxing or resin binder with the powdered brazing alloy and the diamond chips, painting the mixture on a substrate, drying and brazing, preferably below 1200 C. in a vacuum or reducing atmosphere. The process may be two-stage, with the diamond chips omitted initially, to give improved tool surface control. Examples of brazing alloys are Cr 7%, B 2À9%, Si 4À5%, Fe 3À0%, C <0À1%, Ni bal.; Cr 13À5%, B 3À0%, Si 4À25%, Fe 4À75%, C 0À75%, Ni bal.; Cr 13À0%, P 10À0%, Ni bal.; Cr 19À0%, B 0À8%, Si 8À0%, W 4À0%, Ni 17À0%, C 0À4%, Co bal.; Cr 21À0%, B 3À2%, Si 3À0%, Co 44À0%, Fe 1À0%, Ni 17À0%, C 0À8%, W 10À0%, Cr 26À0%, Si 4À0%, B 3À3%, Fe 1À0%, C 0À95%, Ni bal.; Cr 19À5%, Si 9À6%, Mn 9À5%, Ni bal.
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Application Number:
JP5348574A
Publication Date:
June 14, 1980
Filing Date:
May 15, 1974
Export Citation:
International Classes:
C22C19/05; B23K1/00; B23K1/19; B23K1/20; B23K35/30; B23P5/00; B24D3/06; B24D3/08; B24D18/00; C04B37/02