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Document Type and Number:
Japanese Patent JPS5524280
Kind Code:
B1
Abstract:
A mounting arrangement for a printed wiring board has flexible tongues, which include bars secured to opposite sides of the board by braided metal strips, engageable in guides in a supporting structure by clamps which form part of the guides. The arrangement achieves good thermal conduction between the supporting structure and the boards without applying stresses to the latter.

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Application Number:
JP257471A
Publication Date:
June 27, 1980
Filing Date:
January 27, 1971
Export Citation:
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Assignee:
LUCAS LTD JOSEPH
International Classes:
H05K7/14; H05K7/20; (IPC1-7): H05K7/14; H05K7/20



 
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