Document Type and Number:
Japanese Patent JPS5679458
Kind Code:
U
Application Number:
JP16341879U
Publication Date:
June 27, 1981
Filing Date:
November 26, 1979
Export Citation:
International Classes:
B60S1/46; B60S1/38; (IPC1-7): B60S1/38
Previous Patent: 反応部往復路ダクトを有する熱交換部一体型反応器
Next Patent: PRETREATMENT METHOD FOR PLATING OF EXTERNAL LEAD WIRE AFTER SEMICONDUCTOR MOLDING
Next Patent: PRETREATMENT METHOD FOR PLATING OF EXTERNAL LEAD WIRE AFTER SEMICONDUCTOR MOLDING