Document Type and Number:
Japanese Patent JPS5745148
Kind Code:
B2
Abstract:
The invention is related to a method for pumping of liquid metals having a low electrical conductivity. To lower the resistance of the conductive spire containing liquid metal to be pumped, a tape formed by a conductive metal such as copper or nickel is inserted in that spire. The tape is interrupted at the level of the air gap of the main magnetic circuit at least when the conductive spire passes through that air gap.
Application Number:
JP1810875A
Publication Date:
September 25, 1982
Filing Date:
February 14, 1975
Export Citation:
International Classes:
H02K44/02; H02K44/04