Title:
SOLID-STAGE IMAGE PICKUP ELEMENT
Document Type and Number:
Japanese Patent JPS58139462
Kind Code:
A
Abstract:
PURPOSE: To facilitate a package for a solid-state image pickup element by connecting a solid-state image pickup element pellet which is bonded to a tape carrier to external guide leads provided on a transparent glass, filling transparent resin in the gap between the glass and the element and then sealing with the resin.
CONSTITUTION: An element pellet 1 bonded to a tape using a tape carrier 9 is connected to a glass substrate 2 provided with printed wirings 7, transparent resin 5 is filled in the gap to the glass 2, and the pellet is potted with resin 8. According to this structure, Pb-Sn can bond at 183°, Pb-In alloy can bond at further lower temperature, thereby functionally mounting in small size.
Inventors:
MIYAMOTO KEIJI
KAWANOBE TOORU
KAWANOBE TOORU
Application Number:
JP2114982A
Publication Date:
August 18, 1983
Filing Date:
February 15, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/29; H01L23/31; H01L27/14; H01L31/0203; H04N5/335; (IPC1-7): H01L23/02; H01L27/14; H04N5/30
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)