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Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS58173176
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. excellent in tentative adhesion and water-resistant adhesion, without increase in viscosity with time, with low formaldehyde liberation, suitable for wooden material, by blending an alkylresorcinol monomer and a water-soluble org. solvent with an amino resin.

CONSTITUTION: 2W20pts.wt. alkylresorcinol monomer (e.g., methylresorcinol) and, if necessary, tentative adhesion improver (e.g., sodium alginate), filler (e.g., gypsum), etc. are blended with 100pts.wt. amino resin (e.g., phenolic resin) to dissolve or disperse in a water-soluble org. solvent (e.g., methanol).

EFFECT: It is possible to reduce the amt. of formaldehyde liberated due to the reaction of alkylresorcinol monomer with free formaldehyde in the amino resin.


Inventors:
ICHIKAWA TOSHIHARU
FUKUDA JIROU
OZAKI KATSUMI
Application Number:
JP5561882A
Publication Date:
October 12, 1983
Filing Date:
April 02, 1982
Export Citation:
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Assignee:
AIKA KOGYO KK
International Classes:
C08L61/00; C08L61/20; C09J161/20; (IPC1-7): C08L61/20; C09J3/16



 
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