Title:
【考案の名称】半導体ウエハの乾燥装置
Document Type and Number:
Japanese Patent JPS58196837
Kind Code:
U
Inventors:
Masahiko Oka
Application Number:
JP9496782U
Publication Date:
December 27, 1983
Filing Date:
June 24, 1982
Export Citation:
International Classes:
H01L21/304; F26B3/00; F26B7/00; G03F7/26; H01L21/027; H01L21/30; (IPC1-7): H01L21/30; F26B3/00