Title:
【考案の名称】半導体部品の放熱装置
Document Type and Number:
Japanese Patent JPS5821179
Kind Code:
Y2
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Inventors:
Masataka Hosono
Murakami Masatoshi
Murakami Masatoshi
Application Number:
JP12728676U
Publication Date:
May 04, 1983
Filing Date:
September 20, 1976
Export Citation:
Assignee:
NEC
International Classes:
H05K7/20; H01L23/00; H01L23/32; H01L23/34; H01L23/36; H05K3/30; (IPC1-7): H01L23/36; H05K7/20
Attorney, Agent or Firm:
Uchihara Shin