Title:
FILM THICKNESS MONITOR FOR THIN FILM FORMING APPARATUS
Document Type and Number:
Japanese Patent JPS5860531
Kind Code:
A
Abstract:
PURPOSE:To permit even the thickness of a thin film to be readily monitored and controlled, by annexing to a thin film forming apparatus an optical monitor adapted to project light to a thin film of a monitor substrate and receive the light reflected or transmitted by the thin film to deliver an output signal corresponding to the reflectance or transmission of the thin film. CONSTITUTION:Thansfer mechanisms 14p and 14q are adapted to be able to transfer a main substrate 13p and a monitor substrate 13q at any desired speeds respectively. The thickness of a thin film formed on the main substrate 13p is monitored and controlled by means of optical monitors 23aq and 23bq (or 27q) for the monitor substrate 13q. It is to be noted that although optical monitors 23ap, 23ap1-3, 23bp, 23bp1-3 (or 27p1-3) for the main substrate 13p can be arranged in the same manner as the conventional one to monitor and control the thickness of the thin film, these optical monitors for the main substrate 13p are auxiliarily used.
Inventors:
TOKU AKIHIKO
Application Number:
JP15816581A
Publication Date:
April 11, 1983
Filing Date:
October 06, 1981
Export Citation:
Assignee:
ULVAC CORP
International Classes:
C23C14/54; H01L21/203; H01L21/285; H01L21/66; (IPC1-7): C23C13/00; H01L21/285; H01L21/66
Attorney, Agent or Firm:
Shigeru Yagita